Prime Wafer

Prime Wafer Polishing Slurries

Nalco Water has supplied colloidal silica to the wafer industry for decades, and our comprehensive and wide-ranging expertise allow us to produce some of the highest quality silicon polishing slurries in the industry. 

Our highly stable colloidal silica products offer exceptional purity, controlled particle size, distribution, and morphology for optimum performance in your prime wafer polishing processes.

연락처


Designing Wafer Polishing Slurries For:

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High removal rates

 

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Steady performance

 

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Low defectivity

 

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Excellent surface finish and planarity


Ready-to-use Colloidal Silica Slurries for Silicon Wafer Polishing

  • Size (nm): 60 
  • pH: 11 
  • Stabilizing: Na+

  • Size (nm): 60 
  • pH: 8.5 
  • Stabilizing: Na+

  • Size (nm): 85 
  • pH: 11-12 
  • Stabilizing: NH4 
  • Notes: Chelating additive

  • Size (nm): 85 
  • pH: 11-12 
  • Stabilizing: NH4 
  • Notes: High Si removal rate. Hazardous.

  • Size (nm): 120
  • Area m2/gm: 25
  • % Solids: 47
  • pH: 9-10
  • Stabilizing: K+

Chemical Mechanical Planarization

Addressing Multiple Polishing Applications

Our colloidal silica-based polishing slurries are widely used for the stock polish, edge polish and final polish steps in the manufacture of silicon wafers and other semiconductor substrates for microchips.

이러한 슬러리는 광학 제품, 시계용 크리스털 및 기타 유리 부품의 정말 표면 가공에도 사용됩니다.

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Innovating for the Needs of CMP Slurry Formulators

Nalco Water has aligned our colloidal silica manufacturing capabilities to deliver high-purity, innovative nanoparticles to meet the needs of the CMP slurry formulator.

  • Ultra-high purity waterglass-based nanoparticles
  • 다양한 입자 크기, 사이즈 분포 및 농도
  • 광범위한 pH 범위에 걸쳐 안정성을 제공하도록 설계된 제품
  • 긴밀한 상호 협력 연구
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Nalco Water is a Colloidal Silica Leader

  • First patented colloidal silica manufacturing process in 1941
  • One of the largest colloidal silica manufacturers globally
  • Innovative RD&E teams for customized product development
  • Products designed for manufacturing efficiency, quality, and control
  • Delivering high value through innovative particle design and quality support

Contact Our Colloidal Technologies Experts

Let us know how we can help.

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참고

  1. Products were made using LMSII engineered approach to remove metals; [Cu] and [Ni] less than 20 ppb. Availability subject to the volume.↵