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Colloidal Silica Solutions for Electronic Polishing
To achieve the highest quality finish, electronic polishing requires precision, consistency, and manufacturing process control. High quality colloidal silica is an optimal abrasive material for various polishing stages of electronic components (e.g., silicon wafers and integrated circuits (ICs)).
Nalco Water는 다양한 연마 공정 및 응용 분야를 위한 콜로이드 규산 솔루션을 제공합니다. 당사의 포괄적인 제품군은 고객에게 제형을 설계하고 다양한 기판에 대한 연마 성능을 제어하여 조정할 수 있는 유연성을 제공합니다.
Designing Electronic Polishing Solutions For:
Efficient Manufacturing Processes
Low-Metal Content
High Product Quality & Consistency
Tailored Surface and Bulk Physicochemical Properties Include:
- Stiffness
- Purity
- Controlled particle size
- Particle size distribution
- Morphology
Continuous Improvement and Quality Control
The semiconductor industry has been advancing the technology node rapidly and defect reduction and enhancement of operational efficiency is imperative.
Nalco Water emphasizes customer value creation and operational excellence through a strong culture of Continuous Improvement. Our approach integrates multiple methodologies including:
- Lean Six Sigma to drive variation reduction, optimization, and efficiencies in our processes
- Leveraging cutting-edge analytical tools and intelligent technologies to accelerate insights and connect customer performance metrics,
enabling the creation of products tailored to unique customer requirements - Utilizing configuration management and change control solutions that ensure consistent and predictable results
프로그램/제품/장비/서비스
Explore our Electronic Polishing Application Offerings
"에 대한 결과를 찾을 수 없습니다.".
Nalco Water is a Colloidal Silica Leader
- First patented colloidal silica manufacturing process in 1941
- One of the largest colloidal silica manufacturers globally
- Innovative RD&E teams for customized product development
- Products designed for manufacturing efficiency, quality, and control
- Delivering high value through innovative particle design and quality support